Mitsubishi Electric Corp. said it will begin shipping samples of five kinds of power modules for home appliances and industrial equipment starting July 31.
The modules use silicon carbide, a next-generation semiconductor material that is expected to significantly reduce power loss in diode and metal oxide semiconductor field effect transistor chips.
The modules will be showcased at an exhibition on electro-mechanical parts and devices to be held on July 11-13 at Tokyo Big Sight.
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